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+8616678988715 Mon - Fri 09:00 - 17:00 100 Meter North To East Liuting Industrial Park Overpass
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Flexible Printed Circuit Board Suppliers

Production Capabilities

  • SS, DS – Multilayer
  • Low – High QTY
  • 7-10 Day Lead Times
  • 1mil / Laser Drilling

Features and Specifications

Below are industry leading specifications for these complex flex and rigid flex printed circuit boards – which very few flexible pcb manufacturers in the world can produce at our aggressive prices and lead times.

  • Sizes 1 layer-20 layers
  • Sizes up to 20″ x 24″
  • Base PI material in .0005, .001, and .002″
  • PI Coverlay film in .0005, .001, and .002″
  • Adhesiveless & adhesive based stack-ups.
  • Min. line width/spacing for inner layer: 3.5/3.5 mil
  • Min. hole size: 8 mil
  • Blind and buried vias
  • Aspect ratio of 10:1
  • Eco-Bond available
  • PI or FR4 stiffeners
  • Laser trimming
  • Impedance control
  • IPC 6013 Class 2/Class 3
  • IPC-A-600 inspection standards
  • IPC-TM-650, GB/T4677-2002 test standards
  • RoHS Compliance
  • Design consultation available

We can fulfill flex PCB orders of any size – projects large or small.

Fill out our contact form to the left or give us a call today to talk to our experts and experience our top-tier service and delivery.

We have partners with expert engineering support and cutting-edge production capabilities, allowing us to meet your highest IPC standards and specifications.

Here at PCB Solutions, we offer high-quality, quick turn flex printed circuit boards manufacturing services. As highly-specialized flex PCB suppliers, we provide you with expertise required for a quick turnaround time that honors vital delivery deadlines.

PCB Solutions has in-house design, prototyping and manufacturing capabilities to take your printed circuit boards from concept to production. Our highly experienced personnel work with your challenges and create products that satisfy your technological needs.

Additionally, we also offer tool design services, mold making services, sheet metal and cable assemblies among a range of other engineering and manufacturing solutions.

Get in touch with us today to learn more about our cutting-edge production capabilities that meet the most stringent IPC standards and specifications. Or fill out the PCB quote form to get a free estimate.

Choose Your Flex Circuit Board Type

As Flex PCB suppliers we know As Flex PCB suppliers we know each project requires a unique solution:

  • Single-Sided – Boards with a polyimide cover film laminated to the copper to form an FPC that can only be accessed from one side. This conductive layer can be bonded between insulating covers or completely exposed on one side. This application will not have any plated through holes.
  • Double-Sided – This circuit board has a double-layer conductor and it is made with a cover layer of preservative on each side. The PI coated copper board can be etched on two sides to allow access from either side, and may include plated through holes or vias.
  • Multi-Layer – Several single-sided PI-coated copper boards are pressed together with pressure-sensitive adhesive, forming a circuit board with a multi-layer structure and a high pliability.
  • Rigid Flex Circuit Boards – A multi-circuit board that makes use of flex PBC’s high pliability and rigid board’s structural capabilities.

Additional Specs

  • Normal Stack-Up Material
  • Abnormal Stack-Up Material
  • Final Finishing
  • Ink Relevancy
  • Hole/Copper Plating Relevancy
  • Tolerance Control
Normal Stack-Up Material
Conductive Materials Insulating Materials
CCL Base Carrier Bonding Material
Item Thickness Copper Type Item Thickness Item Thickness Bonding Method
Bare Copper 0.5/1/1+OZ RA/ED / / / / /
Single Sided 0.33 / 0.5 / 1 / 1+ OZ RA/ED PI/PET 0.5 / 1 / 2 / 2+Mil Epoxy / Acry lic 0.5 / 1 / 1+Mil Thermo-cure / PSA
Double-Sided 0.33 / 0.5 / 1 / 1+ OZ RA/ED PI/PET 0.5 / 1 / 2 / 2+Mil Epoxy / Acry lic 0.5 / 1 / 1+Mil Thermo-cure / PSA
Abnormal Stack-up Material
Conductive Materials Insulating Materials
      Base Carrier Bonding Material
Item Thickness Type Item Thickness Item Thickness Bonding Method
Aluminum 1 Mil / Specifie Foil Teflon 1 / 2 / 2+ Mil PE / Fibered BS 1/1+ Mil Thermo-cure
Inconel 1 Mil / Specifie Foil FR4-Cloth 1 / 2 / 2+ Mil      
HPM965 Alloy 1 Mil / Specifie Foil          
Kovar Alloy 1 Mil / Specifie Foil          
Silver / Paste          
Final Finishing
Method Thickness Can Be Matched
Emersion Nickel/Gold Au: 1.5~2.5 u”; Ni: 80~200u”; Max Au: 4u” (Not Recommended)
Emersion Nickel/Palladium/Gold Au: 2.0~4.0 u”; Pd: 30~60u” Ni: 100~200u”;
Max Au: 5u” (Not Recommended)
Emersion Silver Ag: 4~15u” Max Ag: 20u” (Not Recommended)
Emersion Tin Sn: 15~25u” Max Sn: 4u” (Not Recommended)
Plating Hard
Nickel/Gold
Au: 20~100 u”; Ni: 100~200 u”; Or Per Customer’s Requirement
Plating Solf Wire
Bonding Gold
Au: 20~100 u”; Ni: 100~200 u”; Or Per Customer’s Requirement
Plating Tin SN: 80~150 u”; Max Sn: 200u” (Not Recommended)
Plating Pure Nickel Ni: 100~300 u”; Or Per Customer’s
Pb-Free HASL Sn: 5~20 um (0.3mm Via Hole Opened)
Pb-Contained HASL Sn/Pb: 5~20 um (0.3mm Via Hole Opened)
OSP 8~16 u”
Ink Relevancy
Solder Mask Ink Select Letter Ink
Color Brand Cure Mode Color Brand Cure Mode
Green Taiyo / Rogers / Ronda / etc. Thermo / UV White / Black Taiyo / Rogers / Ronda / etc. Thermo / UV
Orange Taiyo / Rogers / Ronda / etc. Thermo / UV Customer Specified Hunt Per Requirement Per Spec.
Amber Taiyo / Rogers / Ronda / etc. Thermo / UV Stamp Ink
Black Taiyo / Rogers / Ronda / etc. Thermo / UV Black / Blue / Red / Etc. Taiyo / Rogers / Ronda / etc. Quick Self-Drying
White Taiyo / Rogers / Ronda / etc. Thermo / UV Photo Image Ink
Customer Specified Hunt Per Requirement Per Spec. Blue Taiyo / Rogers / Ronda / etc. Thermo & UV
Hole Relevancy Copper Plating and Relevancy
Hole Size (mm) Achieving Method Via Type Plating Method Thickness Range
0.3 Mechanical Drill Through Panel Plating 8~20 um; 20~30 um; Per Requested
0.25 Mechanical Drill Through / Buried Selective Pad Plating 8~20 um; 20~30 um; Per Requested
0.2 Mechanical Drill Through / Buried / Blind Flash Plating 2~5 um
0.15 Mechanical / Laser Drill Through / Buried / Blind Thickness Control +/- 8 um Per Panel (Normal) +/- 5 um Per Panel (Special)
0.1 Mechanical / Laser Drill Through / Buried / Blind      
0.1- Laser Drill Per Designed      
Tolerance Control
Items Normal Control Special Handling Remarks
Art Work to Vias +/-4 Mil +-2 Mil Available for circuit image, solder mask opening, etc
Stencil to Part +/-6 Mil +/-3 Mil Available for solder and kinds of inks
Coverlay Opening to Pad +/-7 Mil +/-5 Mil Including the tooling Tolerance
Layer to Layer +/-5 Mil +/-3 Mil Including the fiducial punching Tolerance
Hard Die Tooling +/-4 Mil +/-2 Mil Available for outline and special opening
Soft Tooling +/-8 Mil +/-4 Mil Available for outline and special opening
Lazer Cutting +/-1 Mil Available for outline and special opening
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