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Gemini Tec Ltd Solder jet printing for PoP & BGA devices

Advanced surface mount PCB assembly services with solder jet printing technology at Gemini Tec UK.

For the assembly of package on package (PoP devices) and BGA chips onto printed circuit boards for prototype and production orders.

The solder paste is deposited without the need for stencils, the paste is being printed directly onto the SMT pad on demand, just prior to the placement of the SMT device.

The amount of solder paste is tailored to meet the exact requirements of the SMT device and pad. This process removes many of the typical errors that lead to poor quality PCB assemblies. These errors can include over paste – causing short circuits in the oven reflow process, or insufficient solder volumes, leading to time consuming re-work and reliability concerns.

The MYCRONIC MY500 checks solder paste deposits with a optical cameras and can even re-apply paste if ever required. The jet placement head pulls at over 4G as it deposits thousands of solder paste spheres onto each SMT pad, ready for SMT placement.

This process is used to obtain high yield SMT production of BGA and leadless device chips, including Package on Package (PoP). These devices are now used within the Raspberry Pi product, (currently being made in volume by Sony UK) Using solder jet printing technology we can offer customers a cost effective entry into PoP and BGA technology for prototype and production orders.

Contact us for more information on solder jet printing and advanced PCB assembly services from our UK facility.

www.geminitec.co.uk

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