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PCB Lamination Process – Printed Circuit Board Lamination



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With the lamination process, the different circuit layers that make up a board are put together to make the desired number of layers and the chosen thickness. Each job has pins around the perimeter to ensure proper registration. Various copper layers are joined together by pre-preg or dielectric materials to ensure board integrity and thickness.

In each “sandwich” there may be two or three different jobs of the same thickness. They are separated by metal slabs to prevent the squeeze out going from one job to the next. The copper layers already have the picture printed on them and might already have been laminated to that state depending on the board build-up.

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