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Printed Circuit Boards. 04 Multilayer PCB Bonding



The “PCB production technology” film is created for electronic engineers and electronic designers. It demonstrates the multilayer PCB production process at Rezonit tech park.
Full film: https://youtu.be/Su0PIw5OaYQ
Before bonding, the organic complex is deposited on the cleaned copper surface to develop the surface and improve adhesion.
For positioning the inner layers between each other, the bonding machine is used.
After assembly, the stack of inner layers is bonded together by a prepreg using induction heating.
Four molds are loaded onto the lamination press.
Each of these press forms may contain up to 6 panels.
A panel placed between two separating plates makes a stack, which consists of:
The foil of the first outer layer
The prepreg
The stack of inner layers, assembled on the bonding machine
The prepreg
and the foil of the second outer layer
The press forms are gathered together and loaded into a hot vacuum lamination press.

During lamination, the panels are bonded into a single structure.
After hot bonding, the panels are moved to a cold press for controlled cooling.
Then, the press forms are taken apart and the laminated panels are transferred onto the drilled base registration holes.
https://www.rezonit.ru/
Previous video: https://youtu.be/hBpvmCWgxxE
Next video: https://youtu.be/DZH2EA63syg
Music -- Aspire (Standard License, Item ID: 20848639)

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